Method for producing an electronic component using direct bonding
US5771555A · kind A · utility
232Cited by
23References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 1995 |
| Grant date | Jun 30, 1998 |
| Priority date | — |
| Expiry date | May 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a first substrate and a second substrate. A first conductive layer constituting a terminal electrode is formed on a first surface of the first substrate. A first insulating layer is formed on the first conductive layer. The first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.