Seminconductor package
US5773882A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 21, 1997 |
| Grant date | Jun 30, 1998 |
| Priority date | — |
| Expiry date | Feb 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The first semiconductor package comprises a board equipped wiped with a wiring circuit including a connection on a main surface, a semiconductor chip mounted face down having input/output terminal corresponding to the connection of the board, flat external connector terminals leading to and are exposed on the other main surface of the board, and filled via hole connection to be electrically connected to the wiring circuit through a filled via hole installed right above each external connector terminal. Further, the second semiconductor package utilizes the above-described construction but the flat external connector terminals are led to and exposed on the other main surface of the board in a constant-pitch lattice-array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.