Leadframe having contact pads defined by a polymer insulating film
US5776801A · kind A · utility
3Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Feb 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.