Robert M. Smith
13Patents
8h-index
31Co-inventors
68Inventor score
Filing activity: Sep 6, 1991 → Jun 30, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5754855A | System and method for managing control flow of computer programs executing in a computer system | Physics | 49 | Expired |
| US5835768A | Computer operating system providing means for formatting information in accordance with specified cultural preferences | Physics | 46 | Expired |
| US5455949A | Method for representing and signaling run-time program conditions | Physics | 26 | Expired |
| US5608260A | Leadframe having contact pads defined by a polymer insulating film | Electricity | 25 | Expired |
| US7405106B2 | Quad flat no-lead chip carrier with stand-off | Emerging Cross-Sectional Technologies | 24 | Active |
| US6332168A | Method of, system for, and computer program product for providing a run time subsystem for run time libraries | Physics | 21 | Expired |
| US5630137A | Condition handling in a multi-language computer program | Physics | 13 | Expired |
| US5724564A | Computer program product and program storage device for representing and signaling run-time program conditions | Physics | 10 | Expired |
| US6603195B1 | Planarized plastic package modules for integrated circuits | Electricity | 8 | Expired |
| US6306331A | Ultra mold for encapsulating very thin packages | Electricity | 7 | Expired |
| US5776801A | Leadframe having contact pads defined by a polymer insulating film | Electricity | 3 | Expired |
| US6428300B2 | Ultra mold for encapsulating very thin packages | Electricity | 3 | Expired |
| US8134225B2 | Quad flat no-lead chip carrier with standoff | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.