Probe method and apparatus with improved probe contact
US5777485A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Mar 19, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2851
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe apparatus in which a wafer having IC chips arrayed with electrode pads is supported by a pedestal, and the pedestal is moved relatively to a probe card in the X, Y, Z directions to bring the electrode pads into contact with probes of the probe card so as to perform an electric measurement of the part to be inspected, the apparatus includes a parameter setting part for setting a distance in the Z direction between the probe and the electrode pad when the pedestal is moved along the X, Y planes to specify the initial position of the chip, a memory unit for storing the distance in the Z direction set by the parameter setting part, and a control unit for moving the pedestal in the Z direction in a manner to be apart from the probe card on the basis of the distance in the Z direction stored in the memory unit to move the chip to the initial position, and moving relatively the pedestal in the Z direction from the position to the probe card so as to contact the electrode pad of the chip with the probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.