Solid spherical body manufacturing apparatus
US5778964A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1997 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Jan 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0134
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for manufacturing a solid spherical body of solder having high sphericity and high dimensional accuracy comprising a flat plate having a plurality of holes which penetrate the flat plate opening at its upper and lower surfaces, said upper surface being made of material which is not easily wetted by moltens or semi-molten substances, a space to be filled with said molten or semi-molten substance, a cylinder connected with said space, a piston which can elevate within said cylinder pressing said substance in said space upwards and ejecting it at said upper surface of said flat plate through the plurality of holes and a driving device which can move said piston up and down and the spherical bodies are formed by the action of the surface tension of the substance ejected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.