Apparatus for thermal treatment of thin wafers
US5778969A · kind A · utility
8Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1997 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Jul 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for thermal treatment of a thin film wafer is disclosed including a vacuum chamber (10) with a heater assembly (20) positioned in the vacuum chamber (10) and a clamp (31) which presses against the wafer positioned on the heater assembly (20) with the force of the weight of the clamp (31). A vacuum generator (60) forms a vacuum in the vacuum chamber (10) and a gas supply network (100) supplies gas into the vacuum chamber (20) to provide a uniform temperature for the thermal treatment of the wafer. A wafer supply mechanism (50) supplies the wafer to the clamp (31) for thermal treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.