Patent assignee · US · COMPANY

Novellus Systems, Inc.

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998Patents
580Active
998Granted
59Portfolio score

Filing activity: Jul 16, 1990 → Dec 14, 2023 · 287 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7915139B1 CVD flowable gap fill Electricity 775 Active
US7790633B1 Sequential deposition/anneal film densification method Electricity 598 Active
US7265061B1 Method and apparatus for UV exposure of low dielectric constant materials for porogen removal and improved mechanical properties Electricity 573 Expired
US8956983B2 Conformal doping via plasma activated atomic layer deposition and conformal film deposition Electricity 572 Active
US7582555B1 CVD flowable gap fill Electricity 563 Expired
US7208389B1 Method of porogen removal from porous low-k films using UV radiation Electricity 558 Expired
US8137465B1 Single-chamber sequential curing of semiconductor wafers Electricity 552 Active
US6143082A Isolation of incompatible processes in a multi-station processing chamber Electricity 552 Expired
US6284050A UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition Electricity 552 Expired
US7327948B1 Cast pedestal with heating element and coaxial heat exchanger Electricity 551 Expired
US7851232B2 UV treatment for carbon-containing low-k dielectric repair in semiconductor processing Electricity 547 Active
US7888233B1 Flowable film dielectric gap fill process Electricity 543 Active
US7935940B1 Measuring in-situ UV intensity in UV cure tool Electricity 542 Active
US7017514B1 Method and apparatus for plasma optimization in water processing Electricity 540 Expired
US8060252B2 High throughput method of in transit wafer position correction in system using multiple robots Electricity 532 Active
US7482247B1 Conformal nanolaminate dielectric deposition and etch bag gap fill process Electricity 530 Active
US7514375B1 Pulsed bias having high pulse frequency for filling gaps with dielectric material Electricity 530 Active
US8187951B1 CVD flowable gap fill Electricity 530 Active
US7186648B1 Barrier first method for single damascene trench applications Electricity 524 Expired
US7381644B1 Pulsed PECVD method for modulating hydrogen content in hard mask Emerging Cross-Sectional Technologies 520 Expired
US8728956B2 Plasma activated conformal film deposition Electricity 520 Active
US8591659B1 Plasma clean method for deposition chamber Electricity 518 Active
US7745346B2 Method for improving process control and film conformality of PECVD film Electricity 517 Active
US8043972B1 Adsorption based material removal process Electricity 514 Active
US7897215B1 Sequential UV induced chemical vapor deposition Chemistry; Metallurgy 507 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.