Method of manufacturing laminates and printed circuit boards
US5779870A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 1995 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Apr 13, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0726
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Drum or smooth side-treated metal foil can be used either as an intermediate product for use in the manufacture of laminate or as a part of the finished laminate to be used in the manufacture of multi-layer printed circuit board (PCB) packages. By treating the drum or smooth side of metal foil with a bond strength enhancer rather than treating the matte side or rough side, or both sides, several time-consuming and costly steps can be bypassed in the manufacture of multi-layer printed circuit boards (PCB) while the integrity of the metal foil, -laminate and multi-layer PCB are not compromised and are actually enhanced by way of improved impedance control and adhesion characteristics after relamination. This novel foil can be initially bonded to substrate on either side before circuit formation and can be used either as an internal foil layer or as a foil cap. The invention includes methods of manufacture of the metal foil, laminate and multi-layer printed circuit board. A variation of the invention involves a component or tool for use in manufacturing articles such as printed circuit boards. The component is a temporary laminate constructed of one or more sheets of drum-side-treated…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.