Polyclad Laminates, Inc.
9Patents
0Active
9Granted
26Portfolio score
Filing activity: Apr 13, 1995 → Dec 11, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5670250A | Circuit board prepreg with reduced dielectric constant | Emerging Cross-Sectional Technologies | 46 | Expired |
| US5779870A | Method of manufacturing laminates and printed circuit boards | Electricity | 33 | Expired |
| US6584820B1 | Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same | Electricity | 11 | Expired |
| US6618238B2 | Parallel plate buried capacitor | Electricity | 10 | Expired |
| US6632511B2 | Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6955740B2 | Production of laminates for printed wiring boards using protective carrier | Performing Operations; Transporting | 4 | Expired |
| US6436276B1 | Cathodic photoresist stripping process | Physics | 3 | Expired |
| US6609294B1 | Method of bulk fabricating printed wiring board laminates | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6768316B2 | Laser cutting of laminates for electrical insulation testing | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.