Solution to mold wire sweep in fine pitch devices
US5780772A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1997 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Jan 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of preventing non-uniform bonding wire sweep during an encapsulating process of an integrated circuit package includes the step of forming an encapsulating material flow restricting element between two widely spaced functional bonding wires. The integrated circuit package includes an array of electrically conductive leads for electrically connecting the package to other electrical elements and an integrated circuit die having a plurality of input/output terminal pads. A plurality of functional bonding wires electrically connects certain ones of the input/output terminal pads to associated electrically conductive leads such that the functional bonding wires have a predetermined pitch which defines an approximate minimum desired spacing between adjacent functional bonding wires. The plurality of functional bonding wires includes two widely spaced functional bonding wires which are spaced apart from one another by a distance substantially greater than the predetermined minimum desired spacing. An encapsulating material surrounds the die, the bonding wires, and at least portions of the leads. The encapsulating material flow restricting element restricts the flow of the encapsu…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.