Inventor · Saratoga, CA, US

Inderjit Singh

59Patents
14h-index
60Co-inventors
87Inventor score

Filing activity: Aug 2, 1994 → Feb 7, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US5886393A Bonding wire inductor for use in an integrated circuit package and method Electricity 59 Expired
US6511800B1 Methods of treating nitric oxide and cytokine mediated disorders Chemistry; Metallurgy 57 Expired
US7049058B2 Methods for suppressing the induction of nitric oxide synthase in a cell Chemistry; Metallurgy 44 Expired
US6580165B1 Flip chip with solder pre-plated leadframe including locating holes Electricity 30 Expired
US5422892A Integrated circuit test arrangement and method for maximizing the use of tester comparator circuitry to economically test wide data I/O memory devices Physics 29 Expired
US9865567B1 Heterogeneous integration of integrated circuit device and companion device Electricity 24 Active
US6489879B1 PTC fuse including external heat source Emerging Cross-Sectional Technologies 23 Expired
US5938105A Encapsulated ball bonding apparatus and method Electricity 21 Expired
US5912019A Compounds for reducing ischemia/reperfusion injury Human Necessities 18 Expired
US6364089B1 Multi-station rotary die handling device Electricity 16 Expired
US6031216A Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion Electricity 15 Expired
US6213378A Method and apparatus for ultra-fine pitch wire bonding Electricity 15 Expired
US6065667A Method and apparatus for fine pitch wire bonding Electricity 14 Expired
US9418909B1 Stacked silicon package assembly having enhanced lid adhesion Electricity 14 Active
US10043730B2 Stacked silicon package assembly having an enhanced lid Electricity 12 Active
US5780772A Solution to mold wire sweep in fine pitch devices Electricity 10 Expired
US7396659B2 Inhibitors of nitric oxide synthase to treat type 1 diabetes Chemistry; Metallurgy 9 Expired
US5694049A Socketless burn-in board Physics 9 Expired
US9107434B2 Method and apparatus for plasma assisted laser cooking of food products Electricity 8 Active
US8176181B2 Layer-2 management entity messaging framework in a network Electricity 8 Active
US10438863B1 Chip package assembly with surface mounted component protection Electricity 7 Active
US6255141A Method of packaging fuses Electricity 6 Expired
US7254033B2 Method and apparatus for heat dissipation Electricity 6 Expired
US7453158B2 Pad over active circuit system and method with meshed support structure Electricity 5 Expired
US9385106B1 Method for providing charge protection to one or more dies during formation of a stacked silicon device Electricity 5 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.