Digital microelectronic circuit package using buffer dies and programmable device or memory dies
US5781791A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1996 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Apr 16, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the logic and/or storage functions of the original digital microelectronic circuit; the package of the invention can be used as a direct replacement for a digital microelectronic circuit without the requirement that the original circuit board be redesigned to accommodate modern voltage, impedance, and delay specifications associated with the programmable device or memory.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.