Multi-chamber sputtering apparatus
US5783055A · kind A · utility
10Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1996 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Feb 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67213
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-chamber sputtering apparatus characterized in that a plurality of target electrodes and a substrate transfer mechanism which is able to transfer a substrate to positions facing the target electrodes and change distance between the target electrodes and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.