Multi-oxidizer slurry for chemical mechanical polishing
US5783489A · kind A · utility
171Cited by
25References
38Claims
0Family size
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Key dates
| Filing date | Sep 24, 1996 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Sep 24, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing slurry comprising at least two oxidizing agents, an organic acid and an abrasive and a method for using the chemical mechanical polishing slurry to remove titanium, titanium nitride, and an aluminum alloy containing layer from a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.