Method of mounting a flip-chip
US5784780A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 3, 1997 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Jan 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for mounting a semiconductor device to a circuit board. An insulating substrate is provided, which has at least one layer, and provides rigidity to the package. A plurality of electrically conductive contacts are disposed on the top surface of the substrate, receive the semiconductor device, and make electrical contact between the semiconductor device and the substrate. A plurality of electrically conductive through-holes are formed in the substrate, and extend from the top surface of the substrate to the bottom surface of the substrate. The through-holes make electrical connection between all of the layers of the substrate. Electrical interconnections between the contacts and the through-holes are provided by a plurality of electrically conductive traces. A z-conductive layer is attached to the bottom surface of the substrate. Electrical continuity between the bottom surface of the z-conductive layer and the through-holes extending to the bottom surface of the substrate is substantially limited to the z axis of the z-conductive layer according to a predetermined pitch. A plurality of electrically conductive connectors are attached to the bottom surface of the z-conductiv…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.