Mike C. Loo
8Patents
8h-index
4Co-inventors
54Inventor score
Filing activity: Jul 6, 1993 → May 6, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5637920A | High contact density ball grid array package for flip-chips | Emerging Cross-Sectional Technologies | 265 | Expired |
| US5394009A | Tab semiconductor package with cushioned land grid array outer lead bumps | Electricity | 100 | Expired |
| US5380956A | Multi-chip cooling module and method | Electricity | 87 | Expired |
| US6118180A | Semiconductor die metal layout for flip chip packaging | Electricity | 63 | Expired |
| US5648893A | Upgradable multi-chip module | Electricity | 57 | Expired |
| US5648890A | Upgradable multi-chip module | Electricity | 38 | Expired |
| US6191483A | Package structure for low cost and ultra thin chip scale package | Electricity | 16 | Expired |
| US5784780A | Method of mounting a flip-chip | Emerging Cross-Sectional Technologies | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.