Hermetic package for an electrical device
US5786548A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1996 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Aug 15, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical device package includes an aluminum header having a gold-coated sealing surface and an electrical device mounted within the boundary defined by the sealing surface. An annular gold-coated stainless steel seal ring registers with the sealing surface of the header. An annular bonding layer of a gold-tin alloy lies between, and registers with, the sealing surface of the aluminum header and the stainless steel seal ring. The electrical device is fastened to the header using an electrically and thermally conductive epoxy adhesive. A stainless steel cover has a flange which is welded to the seal ring to form a hermetically sealed package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.