Inventor · Calabasas, CA, US

Daniel A. Huang

4Patents
3h-index
10Co-inventors
43Inventor score

Filing activity: Aug 15, 1996 → Aug 30, 2002

Most-cited inventions

PatentTitleAreaCited byStatus
US5786548A Hermetic package for an electrical device Electricity 19 Expired
US6757968B2 Chip scale packaging on CTE matched printed wiring boards Emerging Cross-Sectional Technologies 8 Expired
US6573124B1 Preparation of passivated chip-on-board electronic devices Emerging Cross-Sectional Technologies 4 Expired
US6560108B2 Chip scale packaging on CTE matched printed wiring boards Emerging Cross-Sectional Technologies 3 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.