Integrated circuit device and fabricating thereof
US5786627A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1997 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Oct 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device includes a substrate, circuit elements on the substrate, and an electrically conductive thermoplastic resin substance electrically connecting the circuit elements on the substrate. Therefore, since variations in the configuration of the thermoplastic resin are quite small relative to those of interconnecting wires, variation in parasitic inductance due to variation in the configuration of the connections is reduced and the uniformity and the reproducibility of the high frequency characteristics of the integrated circuit device are enhanced. A method for fabricating an integrated circuit device includes forming circuit elements on a substrate and forming an electrically conducting thermoplastic resin substance electrically connecting the circuit elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.