Semiconductor device and semiconductor device unit
US5786985A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1996 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Nov 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.