Wiring pattern inspection apparatus for printed circuit board
US5787191A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1995 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Jun 6, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30141
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A wiring pattern inspection apparatus for inspecting an abnormality of a wiring pattern formed on a printed circuit board, which is equipped with an optical image pickup device for optically illuminating a surface of the printed circuit board including the wiring pattern to photoelectrically convert optical information of the printed circuit board surface due to the optical illumination into a grey level image. This grey level image is converted into a bi-level image which separates the grey level image into the wiring pattern side and a background side of the wiring pattern. Thereafter, the bi-level image is once contracted by a first size and then expanded by a second size so as to eliminate a micro conductive portion left on the printed circuit board or a micro pinhole which can be disregarded in the abnormality inspection, thereby preventing the excessive detection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.