Method of selectively depositing a metallic layer on a ceramic substrate

US5787578A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Shaji Farooq · Hopewell Junction, US
• Suryanarayana Kaja · Hopewell Junction, US
• John U. Knickerbocker · Wappingers Falls, US
• Brenda Peterson · Wappingers Falls, US
• Srinivasan N. Reddy · Lagrangeville, US
• Rao V. Vallabhaneni · Wappingers Falls, US
• Donald R. Wall · Poughkeepsie, US

Key dates

• Filing date: Jul 9, 1996
• Grant date: Aug 4, 1998
• Expiry date: Jul 9, 2016

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49163
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Disclosed is a method of selectively depositing a metallic layer on a metallic feature on a ceramic substrate. The metallic layer preferably may be elemental nickel particles, elemental copper particles, a mixture of copper and nickel particles, or copper/nickel alloy particles. The metallic layer is deposited as a paste mixture which includes the metallic particles and a binder material. Through a subsequent heating step, the metallic layer tightly bonds to the metallic feature but only loosely bonds to the ceramic substrate. Thereafter, an ultrasonic treatment is applied to remove the loosely adhered metallic layer on the ceramic substrate. The metallic layer on the metallic feature, being tightly bonded, is not removed by the ultrasonic treatment.