Process that separate and isolate precious and semi-precious metals from electronic circuit boards
US5788167A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 4, 1996 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Jan 4, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S241/38
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Preferred processes to separate metallic and non-metallic constituent components of at least one electronic product are generally comprised of the following steps: (a) repeatedly crushing the at least one electronic product to create a plurality of crushed electronic components; (b) repeatedly screening the plurality of crushed electronic components to ensure that the plurality of crushed electronic components substantially conform to a specific size; and (c) repeatedly separating portions of the plurality of crushed electronic components after steps (a) and (b) into non-metallic constituent components, metallic constituent components and mixed constituent components by weight, the mixed constituent components having both non-metallic constituent components and metallic constituent components; and (d) returning the mixed constituent components to be recrushed, rescreened, and reseparated in steps (a), (b), and (c). In addition, before step (a), the at least one electronic product must be provided or otherwise transported to crushing machines to perform step (a). Likewise, the crushed electronic components must be transported from one crushing machine to another crushing machine and…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.