Insulated cube with exposed wire lead
US5793103A · kind A · utility
11Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1997 |
| Grant date | Aug 11, 1998 |
| Priority date | — |
| Expiry date | May 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semi-conductor device having a conductive lead with an exposed tip disposed within a first insulative material, which is in turn disposed between insulated first and second integrated circuit chips is disclosed. The first insulative material is etched to form a recess after which a second insulative material is deposited on the access plane of the chips and within the recess. The tip of the wire lead is then exposed by either a chemical mechanical polish or by a wet etch/develop process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.