Module mounting assembly
US5793618A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 1996 |
| Grant date | Aug 11, 1998 |
| Priority date | — |
| Expiry date | Nov 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A technique for applying uniform force to an IC chip module, urging the module into electrical contact with one face of a circuit board, is provided. One face of the board has contact pads, and the module has contact members on one surface corresponding to the contact pads. A first clamping member is provided having a pressure applying section and a reaction section mounted for movement toward and away from each other. A second clamping member having a pressure applying section is provided. The module is interposed between the pressure applying element of one of the clamping members and the substrate with the contact members on the module in electrical contact with the pads on the board. Several pins interconnect the reaction section of the first clamping member and the second clamping member to restrain movement of the reaction section of the first clamping member away from the second clamping member. At least one biasing member, preferably including a belville washer, is interposed between the reaction section and the pressure applying section of the first clamping member urging the reaction section and the force applying section away from each other to thereby exert force agains…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.