Methods of making multi-tier laminate substrates for electronic device packaging
US5798014A · kind A · utility
157Cited by
24References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 16, 1996 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Oct 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1074
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making multi-tier laminate substrates for electronic device packaging is provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.