Patent · US Expired

Vertical type semiconductor device and gate structure

US5798550A · kind A · utility

11Cited by
11References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 6, 1995
Grant dateAug 25, 1998
Priority date
Expiry dateJun 6, 2015

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D62/393

Abstract

The present invention involves a vertical type semiconductor device whereby miniaturization and lowered ON resistance of a cell within the device can be achieved without impairing the functioning of the device. The line width of the gate electrode is made smaller to meeting the demand for miniaturization of the cell while the distance between the channel regions which are diffused into the portions below the gate during double diffusion remains virtually equal to that in the device of larger cell size having a low J.sub.FET resistance component. While the width of the gate electrode is set to be smaller, the mask members used during double diffusion are attached to the side walls of the gate electrode, where their width allows the source region to diffuse to the portion under the gate. Accordingly, miniaturization and lowered ON resistance of the cell can be achieved without impairing the functioning of the device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.