Semiconductor wafer support platform
US5800623A · kind A · utility
3Cited by
8References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 18, 1996 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Jul 18, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4583
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Premature equipment failure of susceptors used during plasma processing of semiconductor wafers is avoided by making the holes, characteristic of susceptors, such that the hole diameter is less that the susceptor thickness. In one embodiment, the susceptor includes a pattern of support struts which permits the planar top plate of the susceptor to be made quite thin and yet permits the diameter-to-thickness requirement to be met by aligning the pattern of holes with the pattern of support struts and having the holes penetrate the struts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.