Uniform dielectric film deposition on textured surfaces
US5801104A · kind A · utility
520Cited by
18References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1995 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Oct 24, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/964
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Uniformity of thin deposited layers on textured surfaces is enhanced by reducing the total surface area available to film deposition. The backside surface area of a semiconductor wafer is reduced prior to film deposition, thereby reducing the available surface to deposition when a deposition process is supply-limited. Reducing the backside surface area suppresses nonuniformities in thin film deposition when the deposition process is substantially supply-limited. The present invention is advantageous for improving uniformity of nitride capacitor dielectric layers deposited on textured electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.