Surface reformation method of high polymer material
US5801350A · kind A · utility
25Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 1996 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Mar 21, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.