Semiconductor device with smaller package
US5801433A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1996 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Dec 2, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a semiconductor device comprising an integrated circuit chip, a first lead having a portion extending substantially in parallel to one side plurality of the chip, and a second lead located adjacent to the first lead. Each of the first and second leads has a recess and a projection continuously. The first lead and second lead are arranged adjacent to each other with the recess and projection of the first lead being in engagement with the projection and recess of the second lead. Bonding wires are bonded on the projection of the first lead and the projection of the second lead. The bonding wires electrically connect the chip to the first lead and also to the second lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.