Semiconductor device and semiconductor device unit for a stack arrangement
US5801439A · kind A · utility
122Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1997 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Feb 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.