Controlled bondline thickness attachment mechanism
US5802707A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Mar 28, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed circuit board and the integrated circuit. A thermal grease is applied to the top surface of the integrated circuit. A lid is attached to the bracket to capture the printed circuit board. The lid has a platen that is separated from the integrated circuit by a space which has a predetermined thickness. The space defines the thickness of the thermal grease. Any excess thermal grease is pushed out of the space by the lid so that a consistent thickness of thermal grease is applied for each integrated circuit assembly. The bracket, lid, integrated circuit and printed circuit board can be mounted to a motherboard as a single integrated circuit module. Alternatively, the lid can be detached from the base so that the grease covered integrated circuit can be removed from the tool for subsequently assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.