Wafer polishing head
US5803799A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1997 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Jun 20, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head for polishing a semiconductor wafer includes a housing, a wafer carrier movably mounted to the housing, and a wafer retainer movably mounted to the housing. The wafer carrier forms a wafer supporting surface, and the wafer retainer is shaped to retain a wafer in place on the wafer-supporting surface. A first fluid actuator is coupled to the wafer carrier to bias the wafer carrier in a selected direction with respect to the housing, and a second fluid actuator is coupled to the wafer retainer to bias the wafer retainer in a second selected direction with respect to the housing. First and second fluid conduits are coupled to the first and second actuators, respectively, such that fluid pressures in the first and second actuators are separately and independently adjustable with respect to one another. Biasing forces on the retainer can thereby be dynamically adjusted with respect to biasing forces on the carrier during the polishing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.