Microelectronic assemblies including Z-axis conductive films
US5805426A · kind A · utility
21Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1996 |
| Grant date | Sep 8, 1998 |
| Priority date | — |
| Expiry date | Sep 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
First and second electronic devices interconnected by a nonconductive nanoporous film, said film having metal-filled pores extending through the thickness of the film, such that each of said devices is contacted by the metal in at least several pores, wherein said film comprises a silicone polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.