Billy D. Ables
8Patents
4h-index
13Co-inventors
50Inventor score
Filing activity: Sep 24, 1996 → Dec 30, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6633079B2 | Wafer level interconnection | Electricity | 26 | Expired |
| US5805426A | Microelectronic assemblies including Z-axis conductive films | Electricity | 21 | Expired |
| US6512300B2 | Water level interconnection | Electricity | 11 | Expired |
| US7535093B1 | Method and apparatus for packaging circuit devices | Electricity | 6 | Active |
| US7979144B2 | System for forming patterns on a multi-curved surface | Performing Operations; Transporting | 4 | Active |
| US7977208B2 | Method and apparatus for packaging circuit devices | Electricity | 1 | Active |
| US7867874B2 | Method and apparatus for packaging circuit devices | Electricity | 1 | Active |
| US9072164B2 | Process for fabricating a three dimensional molded feed structure | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.