Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
US5806753A · kind A · utility
15Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1995 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Dec 22, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.