Patent · US Expired

Arrangement for handling wafer-shaped objects

US5807062A · kind A · utility

20Cited by

15References

7Claims

0Family size

Assignee

JENOPTIK GmbH · DE

Inventors

Klaus Schultz · Jena, DE
Harald Beckert · Jena, DE
Berndt Lahne · Jena, DE
Manfred Heinze · Viersen, DE

Key dates

Filing date	Jun 13, 1996
Grant date	Sep 15, 1998
Priority date	—
Expiry date	Jun 13, 2016

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S414/141
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An arrangement for handling wafer-shaped objects is to ensure a high degree of positioning accuracy with increased productivity, freely selectable transport paths, and low mechanical expenditure under SMIF conditions. The arrangement has at least one indexing device for supplying and accepting the objects at a supplying and accepting location situated in a handling plane and at least one transporting device for transporting the wafer-shaped objects between the supplying and accepting location and a work station. The work station, together with at least one other work station, is arranged substantially coaxially to a central point through which passes a rotational axis of a changer. The arrangement is applicable in the manufacture of integrated circuits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.