Method for fabricating a heat sink-integrated semiconductor package
US5807768A · kind A · utility
Assignees
Inventor
Key dates
| Filing date | Sep 4, 1996 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Sep 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink-integrated semiconductor package is fabricated by a characteristic method comprising the steps of dispensing a liquid epoxy resin over at least the bare surface of a heat sink mounted with a semiconductor chip, curing said dispensed liquid epoxy resin to form a first encapsulating part so as to prevent delamination at the interface between said heat sink and said semiconductor chip, molding a mold compound to form a second encapsulating part to protect said package from the external environment. The semiconductor package of the present invention, the first encapsulating part is of stronger bonding strength than the second encapsulating part, so that the delamination phenomenon at the interface between heat sink and semiconductor chip can be prevented or relieved efficiently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.