Uniform distribution of reactants in a device layer

US5807792A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Matthias Ilg · Fishkill, US
• Markus Kirchhoff · Radeberg, DE
• Christoph Werner · Mülheim an der Ruhr, DE

Key dates

• Filing date: Dec 18, 1996
• Grant date: Sep 15, 1998
• Expiry date: Dec 18, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02129
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method and apparatus for forming a multi-constituent device layer on a wafer surface are disclosed. The multi-constituent device layer is formed by flowing a first chemistry comprising a first constituent and a second chemistry comprising a second constituent via a segmented delivery system into a reaction chamber. The reaction chamber comprises a susceptor for supporting and rotating the wafers. The segmented delivery system comprises alternating first and second segments into which the first and second chemistries, respectively, are flowed. The first segments comprise an area that is greater than an area of the second segments by an amount sufficient to effectively reduce the diffusion path of the first constituent. Reducing the diffusion path of the first constituent results in a more uniform distribution of the first constituent within the device layer.