Test socket for testing integrated circuit packages
US5808474A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 26, 1996 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Jul 26, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0483
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A socket for testing an integrated circuit ball grid array package having external contacts formed by an array of solder balls is formed with a flexible bladder in the socket bottom. The upper side of the bladder has a test contact pattern that matches the pattern of the solder balls on the package. The side of the bladder carrying the test contact pattern is formed of conventional flexible circuit tape having contacts of spherical, conical or cylindrical shape formed thereon by conventional techniques, with circuit traces also formed on the flexible circuit tape extending to the outside of the socket for connection to test circuitry. Inflation of the bladder drives its test contact pattern against the solder balls of a package held in the socket and forces the flexible test contact substrate of the bladder to conform to any non-planar configuration of the ball grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.