James W. Hively
11Patents
11h-index
7Co-inventors
57Inventor score
Filing activity: Sep 1, 1989 → Sep 25, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5182632A | High density multichip package with interconnect structure and heatsink | Electricity | 125 | Expired |
| US5970321A | Method of fabricating a microelectronic package having polymer ESD protection | Electricity | 71 | Expired |
| US5223741A | Package for an integrated circuit structure | Electricity | 58 | Expired |
| US5955762A | Microelectronic package with polymer ESD protection | Electricity | 57 | Expired |
| US5691949A | Very high density wafer scale device architecture | Electricity | 45 | Expired |
| US5869869A | Microelectronic device with thin film electrostatic discharge protection structure | Electricity | 39 | Expired |
| US5808474A | Test socket for testing integrated circuit packages | Physics | 38 | Expired |
| US5252507A | Very high density wafer scale device architecture | Physics | 31 | Expired |
| US5799080A | Semiconductor chip having identification/encryption code | Electricity | 25 | Expired |
| US5315130A | Very high density wafer scale device architecture | Electricity | 20 | Expired |
| US5514884A | Very high density wafer scale device architecture | Electricity | 16 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.