Mesh planes for multilayer module

US5812380A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Roland Frech · Esslingen am Neckar, DE
• Bernd Garben · Schenefeld, DE
• Hubert Harrer · Böblingen, DE
• Erich Klink · Schenefeld, DE

Key dates

• Filing date: Jan 9, 1997
• Grant date: Sep 22, 1998
• Expiry date: Jan 9, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/09701
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multilayer module for packaging at least one electronic component 50. The module includes a plurality of thickfilm layers, and a wiring structure 45 to permit the connection of on-module capacitors. The multilayer module is fabricated such that the wiring structure includes a partial mesh plane 46, 47, 48, and 49 between the topmost and second topmost layers of the thickfilm. Logic noise is reduced in the multilayer module by maximizing the mutual inductance between adjacent mesh planes.