Inverted stamping process
US5816158A · kind A · utility
12Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 1998 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Feb 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printing of a pattern from a die to a surface is performed by immersing the die in a bath of liquid print material with the die surface facing upward, then either lowering the bath liquid level or raising the die to expose the die surface wet with liquid print material, and contacting the surface to be printed with the wet die surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.