Flux for soft soldering
US5817190A · kind A · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1996 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | May 20, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A flux for soft soldering is disclosed. It comprises a chelating agent as an activator for facilitating a connection of a conductor metal to a soft solder by removing an oxide film naturally formed on the surface of the conductor metal, and for securing insulating reliability after soft soldering by forming complexes with copper and tin which are insulating substance, and a solvent capable of dissolving the chelating agent and further preferably evaporating at soldering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.