Inventor · Kashiwa, JP

Hiroaki Takezawa

29Patents
8h-index
32Co-inventors
75Inventor score

Filing activity: May 20, 1996 → Jul 7, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US6300576A Printed-circuit board having projection electrodes and method for producing the same Emerging Cross-Sectional Technologies 36 Expired
US6465082B1 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body Emerging Cross-Sectional Technologies 17 Expired
US6207550A Method for fabricating bump electrodes with a leveling step for uniform heights Electricity 16 Expired
US6512183B2 Electronic component mounted member and repair method thereof Emerging Cross-Sectional Technologies 14 Expired
US6916433B2 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same Emerging Cross-Sectional Technologies 10 Expired
US6510059B2 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module Emerging Cross-Sectional Technologies 9 Expired
US6521144B2 Conductive adhesive and connection structure using the same Emerging Cross-Sectional Technologies 9 Expired
US7755893B2 Display device Emerging Cross-Sectional Technologies 8 Active
US6429382B1 Electrical mounting structure having an elution preventive film Emerging Cross-Sectional Technologies 8 Expired
US6694613B2 Method for producing a printed-circuit board having projection electrodes Emerging Cross-Sectional Technologies 8 Expired
US6853074B2 Electronic part, an electronic part mounting element and a process for manufacturing such the articles Emerging Cross-Sectional Technologies 7 Expired
US7705536B2 Display device Electricity 7 Active
US6675474B2 Electronic component mounted member and repair method thereof Emerging Cross-Sectional Technologies 7 Expired
US6666994B2 Conductive adhesive and packaging structure using the same Emerging Cross-Sectional Technologies 4 Expired
US6488869B2 Conductive paste, its manufacturing method, and printed wiring board using the same Emerging Cross-Sectional Technologies 4 Expired
US6495247B1 Functional member having molecular layer on its surface and method of producing the same Emerging Cross-Sectional Technologies 3 Expired
US7151306B2 Electronic part, and electronic part mounting element and an process for manufacturing such the articles Emerging Cross-Sectional Technologies 2 Expired
US6203919A Insulating film and method for preparing the same Emerging Cross-Sectional Technologies 2 Expired
US5817190A Flux for soft soldering Performing Operations; Transporting 2 Expired
US6569512B2 Mounting structure for an electronic component and method for producing the same Emerging Cross-Sectional Technologies 2 Expired
US6749889B2 Method for producing mounting structure for an electronic component Emerging Cross-Sectional Technologies 1 Expired
US6376051B1 Mounting structure for an electronic component and method for producing the same Emerging Cross-Sectional Technologies 1 Expired
US6814893B2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Emerging Cross-Sectional Technologies 1 Expired
US6620345B2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Emerging Cross-Sectional Technologies 1 Expired
US10329112B2 Drive transmission apparatus and image forming apparatus Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.