Enhanced wire-bondable leadframe
US5817544A · kind A · utility
15Cited by
17References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 16, 1996 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Jan 16, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for improving adhesion from a leadframe to a metallic wire is disclosed including using a laser beam to remove selected areas of an package adhesion enhancing layer to expose a layer on the leadframe which has a higher adhesion to metallic wires. The package adhesion enhancing layer is from the group consisting essentially of aluminum oxide, anti-tarnish finishes, and dielectrics. The exposed layer on the leadframe is selected from the group consisting essentially of silver, nickel, palladium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.