Optoelectronic interconnection of integrated circuits
US5818984A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1996 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Nov 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microelectronic module comprising at least two chips mounted to a chip receiving surface. Each chip having an edge including at least one chip input and one chip output. The chips are arranged such that the edge of one chip is opposite the edge of the other chip. The chips are spaced apart by a predetermined distance. Each chip includes at least one optical transmitter attached to the edge of the chip. The transmitter has an input coupled to the chip output and a transmission portion for generating optical signals at a predetermined angle and that are representative of signals inputted to the transmitter input. The microelectronic module further includes at least one optical receiver attached to the edge of the chip. The optical receiver has an output coupled to the chip input and a receiving portion for directly receiving optical signals generated by a corresponding optical transmitter of the other chip. The optical receiver and the corresponding optical transmitter form a transmitter/receiver pair. The predetermined distance and the predetermined angle prevent overlapping of the optical signals of the transmitter/receiver pairs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.