Patent · US Expired

Multi-layer susceptor for rapid thermal process reactors

US5820686A · kind A · utility

416Cited by
24References
13Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 2, 1996
Grant dateOct 13, 1998
Priority date
Expiry dateFeb 2, 2016

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC30B31/14
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A RTP reactor susceptor is a multi-layer structure. A first layer of the RTP susceptor is a thin layer of preferably silicon carbide, graphite, or silicon carbide coated graphite with a thickness less than about 6 mm, with an emissivity such that the first layer radiates heat, and with thermal heat transfer characteristics such that the first layer facilitates maintaining a substrate or substrates supported by the susceptor at a uniform temperature, and facilitates maintaining uniform process gas characteristics over the substrates. A second layer of the susceptor is transparent to the heat source of the RTP reactor and provides a rigid, stable platform for the first layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.